Heterogeneous Integration: Key to the Future

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Background

SEMI Connecting Heterogeneous Systems Summit is to be held at the very beginning of September, 2021 and lasts for three days. Due to the Covid-19 situation, the SEMI Summit would take place as a virtual event where 3D semiconductor technologies, MEMS and other semiconductor solutions will be the core attention.

The summit will focus on the advanced development of heterogeneous integration which SEMI members believe to be the future of the industry which would bring an imperative redefinition to our work and living under the background of the rapid evolution of IoT background.

Easybom has sensed this integration surging as we did in-depth research of Heterogeneous Integration (HI) and we have the following things to share with you.

What is Heterogeneous Integration?

Shortly speaking, compared to the conventional chip-level integration (SoC: System on Chips), heterogeneous integration refers to multi-components system-level integration (SiP: System in Package). That’s like an SoC with more devices, which means, as a set of chips heterogeneous-integrated equipment that functions in a comprehensive way to achieve the maximum outcome from each specialized chip.

After the 2019 HIR (Heterogeneous Integration Roadmap) come out, the industry is given a clearer vision of what challenges and chances are for the future of HI development.

The Roadmap also pointed out several solutions that HI may bring for those applications:

  • Single-chip and multi-chip modules
  • Single Integrated photonics
  • Integrated power electronics
  • Integrated sensor platforms
  • MEMS sensors
  • 5G eMobility

Benefits Brought by HI

There lays quite a significant difference between traditional IC designing and Heterogeneous Integration. 

At each manufacturing node, traditional IC design tendencies are to pack more transistors on a monolithic die or system-on-chip (SoC), resulting in challenging chip scaling for analog, logic, and memory circuit integration. However, Die-partitioning or chipsets, a heterogeneous integration technique, offers a strong value proposition for yield increase, IP reuse, performance, and cost optimization, as well as a decrease in time-to-market.

With the progress of Moore’s Law slowing down, and the rapid development of information technology as well as the accelerated popularization of digital transformation stimulate a large number of diversified demand for computing power, the heterogeneous integration that can effectively improve the IO density and computing density on the chip is regarded as a new opportunity for the development of advanced closed testing technology.

Designers will be able to have stronger flexibility and foresee optimizing products through Virtual prototyping, chip-package-board/system co-design as well as reliability prediction.

Heterogeneous Integratiohttps://www.easybom.com/n provides higher throughput and higher yield on wafer level. Besides, a quick reaction is allowed and the process parameters can be easier to adjust.

For those devices that require high computing power or relatively large volume, Heterogeneous Integration can offer a cost-effective and space-saving solution.

Conclusion
From Easybom’s point of view, heterogeneous integration required more advanced production tools and supply chains. In the future, certain challenges may occur during the HI innovation. To keep pace with that, efforts should continuously be put into exploring more possibilities.

From Easybom’s point of view, heterogeneous integration required more advanced production tools and supply chains. In the future, certain challenges may occur during the HI innovation. To keep pace with that, efforts should continuously be put into exploring more possibilities.

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